منابع مشابه
Modelling noise and delay in VLsl circuits
In a second experiment, a microstrip patch antenna was attached directly to a thermalite block (440 x 215 x 100 mm) and the dipole-like radiation panems measured in an anechoic chamber. The results given in Figs. 20 and h show the effect of placing radar absorbent material (RAM) on the block ends to absorb the surface wave contribution. With no absorbent material the surface waves result in som...
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The evolution of Integrated Circuit designing has been a real game changer in the field of VLSI system in the past quarter century. Very deep sub-micron (VDSM) technologies embracing sub-100nm wafer design technologies, to take advantage of the superior integration possibilities. At these technologies, many phenomena affect gate, path delay or wire delays. Now a days, crosstalk noise or crossta...
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This paper addresses the problem of efficiently and accurately generating two-vector tests for crosstalk induced effects, such as pulses, signal speedup and slowdown, in digital combinational circuits. These effects are becoming more prevalent due to short signal switching times and deep submicron circuitry. These noise effects can propagate through a circuit and create a logic error in a latch...
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|Interconnect between a CMOS driver and receiver can be modeled as a lossy transmission line in high speed CMOS VLSI circuits as transition times become comparable to or less than the time of ight delay of the signal through the interconnect. In this discussion, a linear resistor model is used to approximate the CMOS driver stage, and the CMOS receiver is modeled as a capacitor. A closed form e...
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Placing shields around a victim signal line is a common way to enhance signal integrity while minimizing delay uncertainty. An analytic model of the peak noise is developed for shielded interconnects based on a model. A design methodology for inserting shields between coupled interconnects to reduce crosstalk noise is presented.
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ژورنال
عنوان ژورنال: Electronics Letters
سال: 2003
ISSN: 0013-5194
DOI: 10.1049/el:20030208